6 courses with the subject NFAB, each shown exactly as we captured it from the college's catalog, with every element we hold. Where the wording looks broken, that is our reading of the catalog, not the college's text.
NFAB 211Material, Safety, and Equipment Overview for Nanofabrication 3:2:3
This course provides an overview of the materials, safety and equipment issues encountered in the practice of “top down” and “bottom up” nanofabrication. It focuses on safety, environmental and health issues in equipment operation and materials handling as well as on cleanroom protocol. Topics to be covered include: cleanroom operation, OSHA lab standard safety training, health issues, Biosafety Levels (BSL) guidelines, and environmental concerns. Safety issues dealing with nanofabrication equipment, materials, and processing are also discussed including those pertinent to biological materials, wet benches, thermal processing tools, plasma-based equipment, stamping and embossing lithography tools, vacuum systems and pumps, gas delivery systems and toxic substance handling and detection. Specific material handling procedures to be discussed include corrosive, flammable, and toxic materials, biological materials, carcinogenic materials, DI water, solvents, cleaners, photo resists, developers, metals, acids, and bases. The course also concentrates on safe equipment maintenance and operation. Students will be given an overview of basic nanofabrication materials, equipment and equipment operation. This technical overview and operational introduction to processing equipment and characterization tools include: chemical processing, furnaces, vacuum-based processing (physical vapor deposition equipment, chemical vapor deposition equipment, and dry etching equipment), and lithography as well as scanning probe microscopy (e.g., atomic force microscopy), optical microscope, electron microscopy (e.g., scanning electron microscopy), ellipsometer, nano spec, and profilometer equipment. A course fee is required. 333
This course is the hands-on introduction to the processing involved in “top down”, “bottom up”, and hybrid nanofabrication. The majority of the course details a step-by-step description of the equipment, facilities processes and process flow needed to fabricate devices and structures. Students learn to appreciate processing and manufacturing concerns including process control, contamination, yield, and processing interaction. The students design process flows for micro- and nano-scale systems. Students learn the similarities and differences in “top down” and “bottom up” equipment and process flows by undertaking hands-on processing. This hands-on exposure covers basic nanofabrication processes including colloidal chemistry, self-assembly, catalyzed nanoparticle growth, lithography, wet and dry etching, physical vapor deposition, and chemical vapor deposition. A course fee is required. Prerequisite: Restricted, see Instructor.
This course is an in-depth, hands-on exposure to materials fabrication approaches used in nanofabrication. Students learn that these processes can be guided by chemical or physical means or by some combination of these. Hands-on exposure includes self-assembly; colloidal chemistry; atmosphere, low-pressure and plasma enhanced chemical vapor deposition; sputtering; thermal and electron beam evaporation; nebulization and spin-on techniques. This course is designed to give students hands-on experience in depositing, fabricating and self-assembling a wide variety of materials tailored for their mechanical, electrical, optical, magnetic, and biological properties. A course fee is required. Prerequisite: Restricted, see Instructor.
This course is a hands-on treatment of all aspects of advanced pattern transfer and pattern transfer equipment including probe techniques; stamping and embossing; e-beam; and optical contact and stepper systems. The course is divided into five major sections. The first section is an overview of all pattern generation processes covering aspects from substrate preparation to tool operation. The second section concentrates on photolithography and examines such topics as mask template, and mold generation. Chemical makeup of resists is discussed including polymers, solvents, sensitizers, and additives. The role of dyes and antireflective coatings are discussed. In addition, critical dimension (CD) control and profile control of resists are investigated. The third section discusses the particle beam lithographic techniques such as e-beam lithography. The fourth section covers probe pattern generation and the fifth section explores embossing lithography, step-and-flash, stamp lithography, and self-assembled lithography. A course fee is required. Prerequisite: Restricted, see Instructor.
NFAB 215Materials Modification in Nanofabrication 3:2:3
This course will cover in detail the processing techniques and specialty hardware used in modifying properties in nanofabrication. Material modification steps to be covered include etching, functionalization, alloying, stress control and doping. Avoiding unintentional materials modification is also covered including such topics as use of diffusion barriers, encapsulation, electromigration control, corrosion control, wettability, stress control, and adhesion. Hands-on materials modification and subsequent characterization is undertaken. A course fee is required. Prerequisite: Restricted, see Instructor.
32 RECOMMENDED SEQUENCE FOR FULL-TIME STUDENTS Part-time students can complete this program by taking one or more courses each semester. Fall Semester I Spring Semester I Summer Fall Semester II Spring Semester II (Capstone Semester @
